Growth opportunities in the thin wafer market look promising over the next six years. This is mainly due to the decreasing size of electronic devices, increasing thin wafers applications such as in advanced packaging applications and LEDs, and the growing number of smartphone and consumer electronics.
Thin Wafer Market Dynamics (including market size, share, trends, forecast, growth, forecast, and industry analysis)
Key Drivers
The augmenting adoption of MEMS technology in portable health monitoring devices coupled with the contracting size of electronic devices size are the prominent drivers accelerating the growth of the global thin wafer market. Also, the growing penetration of smartphones and consumer electronics and a huge amount of material savings will stimulate market growth. The strong demand for telecommunication systems, led by the rising prominence of e-learning, paves the way for market growth. Also, the expanding adoption of MEMS in communication systems, portable medical devices, and automotive sensor devices will strengthen the market share. The miniature design of MEMS allows them to be used in nearly every electronic device, which results in increasing the demand for MEMS in the semiconductor market.
Leading vendors emphasize on satisfying the escalating demand of consumer electronics, wireless devices, and memory disks. Thin wafers possess the capability to deploy thermal and electronic devices management, thereby expected to bolster the market demand. The ultra-thin wafer is more volatile and responsive to damage user stress or cracking. Moreover, the intensifying applications of thin wafers, including power devices, advanced packaging applications, LEDs, and RF devices, will improve the market’s growth. However, the biggest issue faced by organizations is the low efficiency of the thin wafers. Also, the light absorption ability for long wavelengths, especially if the thickness is below 50 mm. The outbreak of the COVID-19 pandemic has resulted in a delay of the investment plans concerned with capacity expansion by the wafer manufacturers. These factors are likely to curb the thin wafer market size.
Regional Drivers
Based on the regional coverage, the Asia-pacific region is projected to lead the market during the forecast period attributed to the increasing adoption of high-end consumer electronics, such as smart home devices and wearables, largely in China and Japan. Also, the growing investments and ongoing expansion in the businesses are further contributing to the market growth. For example, Samsung Corporation in 2019 invested USD 111 billion, intending to expand its Memory and Foundry businesses in the next ten years. Moreover, this region’s semiconductor market is witnessing a higher growth rate led by favorable economic conditions and huge demand for consumer electronics. These factors together will propel the growth of the market.
Thin Wafer Market’s Leading Manufacturers:
- Nissan Chemical Corporation
- DISCO Corporation
- Globalwafers Co. Ltd.
- Siltronic
- SK Siltron Co., Ltd.
- 3M
- Applied Materials, Inc.
- Lintec Corporation
- SUMCO CORPORATION
- Shin-Etsu Chemical Co., Ltd.
Thin Wafer Market Segmentation:
Segmentation by Process:
- Temporary Bonding & Debonding
- UV-Release Adhesives
- Thermal-Release Adhesives
- Solvent-Release Adhesives
- Carrier-less Approach (Taiko Process)
Segmentation by Application:
- MEMS
- CIS
- Memory
- RF Devices
- LED
- Interposers
- Logic
- Others
Segmentation by Wafer Size:
- 125 mm
- 200 mm
- 300 mm
Segmentation by Technology:
- Wafer Grinding
- Wafer Polishing
- Wafer Dicing
Segmentation by Region:
- North America
- United States of America
- Canada
- Asia Pacific
- China
- Japan
- India
- Rest of APAC
- Europe
- United Kingdom
- Germany
- France
- Spain
- Rest of Europe
- RoW
- Brazil
- South Africa
- Saudi Arabia
- UAE
- Rest of the world (remaining countries of the LAMEA region)
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