JINSUNG Electronics Co., Ltd. is a Korean company that specializes in surface mount technology for custom circuit board manufacturing since 1995. It also specializes in Quick turn, High quality HDI circuit board, Custom Flex circuit board and Rigid-Flex circuit board fabrication.
For the past 27 years, JINSUNG has been consistently pursuing its corporate mission that provides all the customers with the best service and fabrication technology in the industry. JINSUNG has been well known for its superior customer service and on-time delivery. It will always stand to be co-operative with the customers. Now Samsung Electronics is one of the customers of JINSUNG.
JINSUNG’s HDI printed circuit board manufacture capability
HDI PCB means the high density interconnect printed circuit board that uses micro-blind and buried via technology. It is a most advanced printed circuit board manufacturing technology. And, HDI PCBs are one of the fastest growing technologies in the PCB industry now. Because HDI PCBs contains the varieties of both the blind via hole and buried via hole, it has a higher circuitry density than traditional circuit boards.
JINSUNG can maintain the Microvias a laser-drilled diameter of typically 0.006″ (150µm), 0.005″ (125µm), or 0.004″ (100µm), which are optically aligned and require a pad diameter of typically 0.012″ (300µm), 0.010″ (250µm), or 0.008″ (200µm).
And JINSUNG can allow additional routing density. JINSUNG’s technology enables that the Micro vias can be via-in-pad, offset, staggered or stacked, non-conductive filled and copper-plated over the top, or solid copper filled or plated. Micro vias add value when routing out of fine-pitch ball grid arrays (BGAs) such as 0.8 mm pitch devices and below.
Additionally, Micro vias add value when routing out of a 0.5 mm pitch device where staggered Micro vias can be used. However, routing micro-BGAs such as a 0.4 mm, 0.3 mm, or 0.25 mm pitch device requires the use of stacked Micro vias using an inverted pyramid routing technique.
